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Package Engineering Services - Tessolve

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Thermal enhanced high density flip chip package

Websubstrate or leadframe, then provides the connection from ... in length (0.1 mm versus 1–5 mm), the inductance of the signal path is greatly reduced. This is a key factor in high-speed communication ... improving performance of the silicon • Higher signal density - The entire surface of the die can be used for interconnect, rather than ... Webthe high current – therefore no wire bonding, no leadframe, and even no mold compound is required. This structure makes the package easy compliance with automotive standard, and all DirectFET2 products are specifically optimized for automotive applications and pass the stringent AEC-Q101 automotive reliability standard. Web2.2 Strip Characteristics for Lead Frames. Lead frames require that the alloy strip from which they are made have a high-quality surface that is free of minute remnants of defects from processing, handling, and airborne contaminants. The concern is that such defects may result in defective plating on the lead frame that in turn could adversely ... how dangerous are black bears